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Anti-Static Octagonal Bottom Pouch ≤10¹² Ω/sq For Electronics Packaging

Anti-Static Octagonal Bottom Pouch ≤10¹² Ω/sq For Electronics Packaging

Brand Name: Bright Pack
Model Number: B010
MOQ: 100pcs
Price: ¥0.02-0.11/pcs
Payment Terms: T/T,Western Union
Supply Ability: 200000pcs/day
Detail Information
Place of Origin:
Guangdong,China
Certification:
patent for invention、BRC、GRS
Customization:
Support
Colour:
Up To 10 Colour Or No Printed
Odor Proof:
Yes
Custom Order:
YES.
Colors:
CMYK/Pantone
Sample:
Free
Puncture Resistant:
Yes
Packaging Type:
Bulk Pack
Quantity Per Pack:
100
Recyclable:
Yes
Quantity:
Pack Of 100 Bags
Bag Type:
Three Side Seal Stand Up Bag
Bpa Free:
Yes
Color:
Transparent
Height:
115 MM
Packaging Details:
Export special carton packaging and plate
Supply Ability:
200000pcs/day
Highlight:

Electronics Packaging Octagonal Bottom Pouch

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Customizable Octagonal Bottom Pouch

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Anti-Static Octagonal Bottom Pouch

Product Description
Anti-Static Octagonal Bottom Pouch ≤10¹² Ω/sq For Electronics Packaging
Product Attributes
Attribute Description
Material Structure 4-layer composite: Static-dissipative polyethylene (outer layer) / Aluminum shielding / Polyester (middle layer) / Static-dissipative coating (inner layer). Optimized for surface resistance control.
Surface Resistance ≤10¹² Ω/sq (anti-static range), compliant with ANSI/ESD S541 and IEC 61340-5-1 standards.
Certifications ISO 9001, ISO 14001, and RoHS/REACH compliance. Suitable for electronics in EPA (ESD Protected Areas).
Barrier Properties Moisture-resistant (WVTR ≤5 g/m²*24h at 38°C/90% RH); moderate oxygen barrier (OTR ≤50 cm³/m²*day).
Design Features Octagonal bottom for stability; heat-sealable or zip-lock closure; customizable print area for branding.
Applications PCB, RAM, motherboards, IC chips, and other ESD-sensitive components.
Sustainability Recyclable polyethylene layers; optional biodegradable additives.
Technical Specifications
Parameter Specification
Thickness Range 0.08-0.15 mm (customizable for lightweight to heavy-duty electronics).
Dimensions Width: 100-400 mm; Height: 150-600 mm; Bottom gusset: 50-150 mm.
Tear Resistance ≥35 N (machine direction) / ≥30 N (transverse direction).
Seal Strength 5-8 N/15mm (heat-sealable at 120-140°C).
Static Dissipation Surface resistance: 10⁶-10¹² Ω/sq; ESD shielding energy ≤30 nJ.
Printing Options 4-color flexographic printing (±0.2 mm accuracy); supports QR codes and GS1 barcodes.
Temperature Range -40°C to 85°C (suitable for cold chain and industrial environments).
MOQ & Lead Time MOQ 50,000 units; production lead time: 15-25 days.
Anti-static octagonal bottom pouch front view Close-up of pouch material layers Pouch with electronic components inside Pouch sealing mechanism detail Pouch dimensions demonstration Printed branding on pouch surface Pouch stack showing quantity Pouch with barcode label Pouch in industrial environment Pouch material cross-section Pouch with different closure types Pouch quality inspection Pouch packaging for shipping Pouch with electronic components Pouch in ESD protected area Pouch manufacturing process